Redmi Turbo 4 is about to reach in China in early 2025. The firm has confirmed that it is going to be the primary telephone to launch with the MediaTek Dimensity 8400-Ultra chipset. Notably, MediaTek lately launched its Dimensity 8400 SoC. Realme has confirmed that considered one of its future handsets will carry this processor. A tipster claims that it is going to be the Realme Neo 7 SE. It is anticipated to affix the Realme Neo 7, launched in China earlier this month.
Redmi Turbo 4 Launch
Redmi confirmed in a Weibo submit that its upcoming Turbo 4 handset, which is about to launch in early 2025, will probably be powered by a MediaTek Dimensity 8400-Ultra SoC. It is claimed to be the primary telephone to get that chipset.
Previous leaks have claimed that the Redmi Turbo 4 will doubtless arrive in China by January 2025. A leaked design render of the upcoming smartphone suggests it is going to have a twin rear digicam setup and a flat show with uniform, very slim bezels.
Realme Neo 7 SE Teased
Realme, alternatively, teased the launch of a brand new smartphone with the MediaTek Dimensity 8400 SoC, which was lately unveiled. The firm didn’t reveal the title of the upcoming handset. Tipster Digital Chat Station (translated from Chinese) advised that this could possibly be the Realme Neo 7 SE.
The MediaTek Dimensity 8400 chipset sits above the Dimensity 8300 and comes with eight Arm Cortex-A725 cores, the place a main core clocks at 4.32GHz. It is paired with the Arm Mali-G720 GPU and is alleged to assist as much as LPDDR5x RAM and UFS 4.0 onboard storage. The processor features a MediaTek NPU 880, which helps it carry out generative AI duties.
The newest MediaTek chipset additionally has an inbuilt MediaTek Imagiq 1080 ISP which is claimed to assist seize extra gentle and focus sooner. Smartphones with this SoC are mentioned to assist as much as 320-megapixel digicam sensors and shows with as much as WQHD decision with as much as 144Hz refresh fee.
